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EWA
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Forschung
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Themen
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Halbleiter-Bauelemente
Thermische Charakterisierung von Halbleitern
1104-1112, Aug. 2023, doi: 10.1109/TCPMT.2023.3299788 Jahn, N. ; Pfost, M. : Efficient Simulation fo the Effect of Solder Voids and Tilting on the Cooling of Power Semiconductors , 2023 International Conference [...] Adjacent Sensors , Thermal Investigations of ICs and Systems (THERMINIC), Budapest, 09.2023, doi: 10.1109/THERMINIC60375.2023.10325910 Jahn, N. ; Pfost, M. : Thermal Onboard Detection of Voids in the Solder [...] and Experiments in Microelectronics and Microsystems (EuroSimE) , Graz, Austria, 03.2023, doi: 10.1109/EuroSimE56861.2023.10100817 Jahn, N. ; Pfost, M. : Detection of Bond Wire Failure in Power Semiconductors …